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China will lead the world in capital spending on mainstream 300mm semiconductor fabs, with $30 billion invested in each of the next four years, U.S.-based industry group SEMI predicted Monday.
SEMI said the country’s spending will be “driven by government incentives and domestic self-sufficiency policies.” 300mm refers to the diameter of wafers used in semiconductor manufacturing. Equivalent to approximately 12 inches.
According to SEMI, Taiwan is expected to rank second in capital spending in 2027 with $28 billion, up from $20.3 billion in 2024. South Korea is expected to rank third in 2027 with $26.3 billion, up from $19.5 billion this year.
This increase will be driven by new AI-related applications, more resilient memory chips, and strong demand for high-performance computing, with spending expected to exceed $100 billion for the first time by 2025 and reach a record $137 billion in 2027. This is part of what is expected to increase. SEMI states: Rising demand for AI-related chips has sent stock prices of suppliers and manufacturers such as Nvidia and Taiwan Semiconductor Manufacturing soaring over the past year.
“The forecast for rapid growth in 300mm manufacturing equipment spending over the next few years reflects the growing demand for electronics across a variety of markets and the production capacity needed to meet the new wave of applications created by innovations in artificial intelligence. ” said Ajit Manocha. said SEMI’s president and CEO in a statement.
Manocha said the report also highlights the impact of government support in semiconductor manufacturing on economies and security around the world. “This trend is expected to help significantly narrow the gap in capital spending between re-emerging and emerging regions and Asia’s historical top spending regions,” he said.
China, one of the world’s largest electronics products makers, is pushing to reduce its dependence on foreign chip suppliers amid geopolitical tensions and President Xi Jinping’s heightened security concerns. . The Financial Times reported today that the Chinese government has introduced guidelines to gradually purchase chips from US suppliers Intel and AMD for government PCs and servers. Microsoft Windows and foreign databases would also be excluded, the paper said.
Investment in 300mm fab equipment in the Americas is expected to double from $12 billion in 2024 to $24.7 billion in 2027. Just last week, the U.S. Department of Commerce announced a tentative agreement to provide $8.5 billion to support Intel’s four new semiconductor manufacturing sites in Arizona. New Mexico, Ohio, and Oregon. Elsewhere in the world, capital spending in Japan, Europe, the Middle East and Southeast Asia is expected to reach $11.4 billion, $11.2 billion and $5.3 billion in 2027, according to SEMI.
SEMI noted that the demand for increased data throughput, which is critical for AI servers, is driving strong demand for high-bandwidth memory (HBM) and spurring increased investment in memory technology. Memory ranks second among all segments and is projected to generate $79.1 billion in equipment purchases in 2027, reflecting a 20% annual increase from 2023, the industry said. the group said.
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